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SAM北美主管在2017年(印度)全球软包装与特种薄膜峰会发言

  • SAM Marketing /
  • Date 2017.02.02 /
  • Hit 2,018 /

SAM北美主管在2017年(印度)全球软包装与特种薄膜峰会发言

 

 


Developing Flexible Packaging with Pilot Scale Lines was the topic of the presentation given by Andy Christie, Managing Director of SAM North America, during the 5th Annual Specialty Films and Flexible Packaging Summit held in Mumbai, India.


 


The context of the product development presentation was the utilization of pilot line technologies to transform good ideas into a valued product for the consumer and at the same time increase the profitability of the producer.  Preparing package materials on a pilot scale production line allows validation of both materials (fit-for-use) and processes (fit-to-make). The process generates samples for a full array of testing including customer packaging-machine trials and shelf-life testing. 


 


SAM R & D Centers offer extrusion and solution coating pilot lines for customer use to validate processes, products and new materials.  Contact sales@sam-na.com or sam_rnd@sungan.net for additional information.

 


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